JPH0217487Y2 - - Google Patents
Info
- Publication number
- JPH0217487Y2 JPH0217487Y2 JP12890081U JP12890081U JPH0217487Y2 JP H0217487 Y2 JPH0217487 Y2 JP H0217487Y2 JP 12890081 U JP12890081 U JP 12890081U JP 12890081 U JP12890081 U JP 12890081U JP H0217487 Y2 JPH0217487 Y2 JP H0217487Y2
- Authority
- JP
- Japan
- Prior art keywords
- power diode
- mounting plate
- wiring board
- printed wiring
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12890081U JPS5834744U (ja) | 1981-08-31 | 1981-08-31 | パワ−ダイオ−ドの実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12890081U JPS5834744U (ja) | 1981-08-31 | 1981-08-31 | パワ−ダイオ−ドの実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5834744U JPS5834744U (ja) | 1983-03-07 |
| JPH0217487Y2 true JPH0217487Y2 (en]) | 1990-05-16 |
Family
ID=29922579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12890081U Granted JPS5834744U (ja) | 1981-08-31 | 1981-08-31 | パワ−ダイオ−ドの実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834744U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61162032U (en]) * | 1985-03-28 | 1986-10-07 |
-
1981
- 1981-08-31 JP JP12890081U patent/JPS5834744U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5834744U (ja) | 1983-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5969950A (en) | Enhanced heat sink attachment | |
| US20230200022A1 (en) | Two-phase immersion type heat dissipation substrate | |
| JPH0217487Y2 (en]) | ||
| CN217985815U (zh) | 散热器、电路板模块及电子设备 | |
| JPH0217486Y2 (en]) | ||
| CN222996743U (zh) | 具有多电器元件的高效散热的电路板 | |
| CN222602837U (zh) | 一种耐高温的pcb电路板 | |
| CN222655030U (zh) | 一种轻量化高散热效率电源适配器 | |
| JPH04130759A (ja) | ヒートシンク | |
| CN222089445U (zh) | 一种集成式ac-dc变换器 | |
| CN220068129U (zh) | 一种电源ic散热结构 | |
| JPH0227566Y2 (en]) | ||
| CN222263113U (zh) | 一种电源散热结构 | |
| CN216134650U (zh) | 一种模块化控制电路板 | |
| JPH0322921Y2 (en]) | ||
| JPH0325414Y2 (en]) | ||
| JPS5852687Y2 (ja) | ダイオ−ド取付装置 | |
| JPS5812449Y2 (ja) | 放熱板付ｉｃの取付装置 | |
| JPH0438139B2 (en]) | ||
| JPS59155158A (ja) | 半導体装置の冷却構造 | |
| JPH0138922Y2 (en]) | ||
| JPH0356078Y2 (en]) | ||
| US3210619A (en) | Solid state rectifier construction | |
| JPH021916Y2 (en]) | ||
| SU1637048A1 (ru) | Радиоэлектронный блок |